Products and platforms
Centrillion products start with a shared wafer-scale DNA chip platform, then adapt probe content, assay chemistry, chip format, and analysis to the biological question. The result is a family of spatial, custom, and genotyping arrays built for scale.
Core manufacturing platform
Photolithographically synthesized DNA chips combine billions of addressable probes, wafer-scale process control, flexible assay design, and a path to economical volume production.
Explore High-Density DNA ChipsCommercially available spatial arrays
Available in 5 mm × 5 mm and 10 mm × 10 mm formats, with Gray-code spatial addresses, continuous 2 µm features, and up to 25 million features.
Explore Sequoia Spatial ChipsCustom high throughput arrays
A compact 1 mm × 1 mm DNA chip configured with tag content or custom probe content for high-throughput applications.
Explore Custom ATOM™ ChipsAvailable in the Asia Pacific market
Custom genotyping arrays support content from 50,000 to 2 million variants per chip for focused studies and population-scale programs.
Explore Custom Genotyping ArraysMultiplex detection and surveillance
Use programmable probe content to detect many pathogens in parallel or decode viral genomes for surveillance and variant monitoring.
Explore Pathogen Detection and SequencingLimited early access for collaborators
An early collaboration program exploring how zip-code-addressed spatial chips can preserve and connect information across long DNA molecules.
Explore Spatial Chips for Long DNA SequencingSelective custom programs
Centrillion opens its DNA chip platform to a limited number of ambitious custom programs. Partners bring the application vision and chip design. Centrillion contributes deep experience in surface chemistry, photodirected synthesis, chip engineering, process integration, and wafer-scale production.
Our platform partnership model keeps your team focused on the program, product, and IP while our platform turns the design into a manufacturable molecular surface. Capacity is intentionally limited, so we prioritize programs that expand what high-density DNA chips can measure.
Your design and associated intellectual property remain yours under the program agreement.
Most programs use the leverage of a full wafer process. For selected programs, multiple chip designs can be combined within a single die.
Tape-out (the point when the finalized chip design is released to the fab for wafer fabrication) is the key manufacturing milestone. Timing depends on design complexity, assay requirements, process fit, and production scheduling.
Custom DNA chips